Credit: Robert Triggs / Android Authority

Samsung is reportedly working on a new cooling solution for future Exynos smartphone processors.
This packaging tech is apparently derived from PCs and servers and sees a type of heatsink attached to the top of the processor.
Work on the tech could be completed by Q4 2024, suggesting the Exynos 2500 could potentially use it.

The Exynos 2400 is a respectable flagship processor, although we did notice it ran a little hotter than the Snapdragon 8 Gen 3. Now, it looks like Samsung has a new cooling solution up its sleeve for future Exynos smartphone chipsets.

The Elec reports that Samsung is working on a new chip packaging technology called fan-out wafer-level package-HPB (FOWLP-HPB). This tech involves attaching a type of heatsink, called a heat path block (HPB), to the top of the chipset.

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